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viaduct

Viacrete black tile primer
NOTE: Confidentiality Assurance, your formulation remains 100% confidential. The recipe, technical ratios, and production method provided through Viaduct Blackbox are exclusive to your manufacturing unit. We do not share, disclose, or resell your customized recipe to any other manufacturer under any circumstances.

Viaduct Back Tile Primer

Viaduct Blackbox for Self Levelling Compound is a pre-engineered formulation system designed to help manufacturers produce a high-flow, fast-setting, and smooth-finish levelling compound for floor preparation applications. Built on a controlled polymer-based formulation, it ensures excellent flow, rapid levelling, and uniform surface finish without manual intervention.
This primer creates a bonding bridge that promotes stronger interlocking between the tile surface and adhesive layer, reducing the risk of tile debonding. Suitable for residential, commercial, and large-format tile installations, it is ideal for projects where enhanced adhesion reliability is required.
Manufactured under defined quality standards, Viaduct Back Tile Primer offers manufacturers and private-label brands a dependable solution built for bonding stability and long-term performance.
NOTE: Confidentiality Assurance, your formulation remains 100% confidential. The recipe, technical ratios, and production method provided through Viaduct Blackbox are exclusive to your manufacturing unit. We do not share, disclose, or resell your customized recipe to any other manufacturer under any circumstances.

Quick Specifications

Packaging Units:

1 / 5 / 20 Litre

Packaging Type:

Liquid

Colors:

Black

Quick Specifications

Packaging Units:

1 / 5 / 20 Litre

Packaging Type:

Liquid

Colors:

Black

Key Features

Zero R&D Investment

Start self-levelling compound production immediately without formulation development.

Excellent Flowability

Ensures smooth spreading and automatic levelling without trowelling effort.

Self-Smoothing Finish

Creates flat, even surfaces ready for final floor coverings.

Fast Setting & Early Walkability

Reduces downtime and speeds up flooring schedules.

Strong Substrate Adhesion

Bonds effectively to concrete and cementitious screeds.

Shrinkage-Controlled System

Minimizes cracking and curling during curing.

Consistent Batch Quality

Validated formulation ensures repeatable performance across batches.

Thin & Medium Thickness Application

Suitable for correcting minor to moderate floor undulations.

Scalable Manufacturing

Suitable for small units as well as large-scale production plants.

Minimal Skill Dependency

Production teams can follow the formulation without expert chemists.

Cleaner Production Process

Controlled formulation reduces dust and segregation.

Complete Technical Support in One Box

Recipe, mixing ratios, QC parameters, and production guidelines included.

Technical Specifications

Detailed technical specifications and performance characteristics of Products

Parameters

Results

Colour

Grey

Application

Floor Levelling

Flowability

High

Setting Time

Fast

Shrinkage

Low

Surface Finish

Smooth & flat

Adhesion

Excellent

Thickness Range

Thin to medium

Walkability

Early

Curing Behaviour

Controlled & stable

How to Use Viaduct Blackbox in Manufacturing

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Prepare Mixing Equipment

Ensure mixers are clean, dry, and free from previous batch residue.

Measure Raw Materials

Weigh cement, fillers, and additives as per the formulation guide.

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Open the Blackbox System

Ensure the polymer system is moisture-free and ready for blending.

Add Blackbox to Dry Mix

Introduce the Blackbox polymer into the mixer along with raw materials.

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Blend Uniformly

Mix for the prescribed duration to achieve a homogeneous levelling compound powder.

QC Verification

Check flow, setting behaviour, density, and consistency as per QC guidelines.

Packing & Storage

Pack the finished product into bags, seal properly, and store in dry conditions.

Knowledge Base

Technical Data Sheet (TDS), Product Brochure, Application Guidelines.

Knowledge Base

pdf-1

TDS PDF

pdf-1

Brochure

Frequently Asked Questions

Get answers to common questions about AAC blocks, construction techniques, and project requirements
What is Viaduct Back Tile Primer used for?

It is used to enhance bonding between tile backs and cement-based tile adhesives.

Yes. It is particularly useful for non-absorbent and vitrified tiles where adhesion may be limited.

No. It acts as a bonding enhancer and must be used along with tile adhesive.

Yes. It improves bonding reliability for large-format and heavy tiles.

Yes, depending on installation requirements.

How is batch consistency maintained?

Each batch undergoes viscosity, bonding efficiency, and stability verification before packaging.

Yes. Approved-grade polymers and additives are verified prior to production.

Exclusivity terms can be structured under mutual commercial agreements.

Yes. Variants can be aligned based on performance requirements.

Do you provide private labelling?

Yes. Complete private label and branding support is available.

Yes. Standard and customised packaging options are available.

Exclusivity terms can be structured under mutual commercial agreements.

Yes. TDS and safety documentation are provided.

Yes. Structured supply agreements can be established.

How should Back Tile Primer be stored?

Store in a cool, dry place away from direct sunlight.

Yes. Containers must remain tightly sealed to maintain product stability.

Yes. Avoid exposure to excessive heat or freezing conditions.

Yes. Shelf life details are mentioned on packaging and documentation.

Standard protective measures such as gloves and eye protection are recommended.

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Industry Knowledge Hub

Stay ahead of the curve with our expert insights on construction technology, equipment innovations and industry best practices.

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Still Have Questions?

Our technical experts are here to help with your specific project requirements and questions.

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Need support with formulations, manufacturing, or product selection? Contact us and our team will guide you with the right solution.
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